Rising Demand for Thermal Management in Consumer Electronics driving the growth of Thermal Management Market

[168 Pages Report] Thermal Management Market research report categorizes global market by Material Type (Adhesive, Non-Adhesive), Devices (Conduction, Convection, Advanced, Hybrid), Service (Installation & Calibration, Optimization & Post Sales), End-Use Application.

The thermal management market is expected to be worth USD 14.24 Billion by 2022, growing at a CAGR of 7.91% between 2017 and 2022.

The factors driving the growth of this market include rising demand for thermal management in consumer electronics, growing application arena, and radical miniaturization of electronic devices.

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4 Premium Insights

4.1 Attractive Growth Opportunities in the Thermal Management Market 
4.2 Thermal Management , By End-Use Application 
4.3 Thermal Management , By Device and Region 
4.4 Market, By Service 
4.5 Market, By Country

♦♦Convection cooling devices was the largest segment in terms of market size in 2016

Convection cooling devices are widely used in electronic circuits and printed circuit boards (PCBs). This has resulted in the growth of thermal management device market. Thus, these devices help lower the peak temperature of the systems with natural and forced convection cooling technologies. Devices such as loop heat pipes, heat pumps, heat sinks, and heat spreaders are used in providing effective cooling solutions in processors and computers, among others. Thus, the demand to maintain high efficiency of the electronic devices is expected to fuel the growth of the thermal management market.

♦♦Thermal management market for thermal tapes expected to grow at highest CAGR during the forecast period

Thermally adhesive tapes are used to mechanically and thermally bond electronic components to heat sinks. These tapes consist of a pressure-sensitive adhesive (PSA) film that is filled with thermally conductive materials such as metals, metal oxides, polyimide film, fiberglass mat, aluminium foil, and silica or ceramic particles. These particles allow thermal conduction through the tape. Thermal tapes are widely used for thermal management of the light emitting diodes (LEDs) in the automotive industry as they provide high mechanical strength, and good shock and vibration performance. The increasing use of tapes in consumer electronics and automotive applications is driving the overall market for adhesive materials.

♦♦The market in North America expected to grow at the highest CAGR during forecast period

North America is expected to hold the largest share of thermal management market by 2022, and it holds a tremendous potential for the market in the coming future due to its large investment in healthcare applications, increasing use of electric and hybrid vehicles, and growing data centers across the region. The market in North America consists of some of the leading markets such as the US, Canada, and Mexico.

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♦♦Major players in this market include

*Top 15 Companies Analyzed for This Study are -

Aavid Thermalloy LLC, Honeywell International Inc., European Thermodyamics, Kelvion Holdings GmbH, Master Bond Inc., Advanced Cooling Systems, Vertix Co., Dau Thermal, Solutions Inc., Heatex Inc., Henkel Corp, Gunter AG & Co. Kg, Cryomech, Inc., Vette Corp, Parker Chomerics, AI Technology, Hamon & Cie International S.A., Lord Corporation, Lairdtech, API Heat Transfer Inc., Danfoss S.A., Spx Corporation, Momentive Performance Materials, Chart Industries, Inc., Brooks Automation, Inc., Sunpower, Inc.

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Research Methodology

The research methodology used to estimate and forecast the thermal management market begins with obtaining data on key vendor revenues through secondary research. Some of the secondary sources used in this research include various journals and databases such as OICA, UNODA, IEEE journals, Factiva, Hoovers, and OneSource.

The vendor offerings have also been taken into consideration to determine the market segmentation. The bottom-up procedure has been employed to arrive at the overall size of the market from the revenues of the key players in the market.

After arriving at the overall market size, the total market has been split into several segments and subsegments, which have then been further verified through primary research by extensively interviewing the key officials in the industry, such as CEOs, VPs, directors, and executives.

The market breakdown and data triangulation procedures have been employed to complete the overall market engineering process and arrive at the exact statistics for all segments and subsegments. The breakdown of the profiles of primaries has been depicted in the figure below: